Comprehensive Capabilities For Testing Electronic Components
Quality is our highest priority. We show that commitment by housing a technically-advanced anti-counterfeit inspection lab right inside the Sensible Micro facility.
Custom Test Plans
Customize your quality checks with tailored test plans that match your specific requirements, from counterfeit avoidance to precise component analyses.
Advanced Technical Capabilities
Our lab utilizes cutting-edge inspection technology including the most advanced high-powered microscopy, X-Ray Analysis, XRF Testing, Decapsulation and more to meticulously identify any component discrepancies.
Quality You Can Trust
Through rigorous testing, we guarantee the authenticity and compliance of your components, enhancing both product reliability and brand reputation.
Our Electronic Component Testing Capabilities
Customers also have the option to utilize our in-house lab facility. Depending on end-use application and product type, Sensible Micro can support a custom flow-down inspection or test plan, straight from your quality engineering initiatives. Don’t have one? Sensible Micro can help create a General Counterfeit Avoidance Test (GCAT) plan that supports your application end-use requirements.
High-Power Microscopy
With a magnification ability of 20-1000x and fully-motorized stage, the Keyence VHX2000 provides us with extremely high-resolution imagery and depth-of-field photography, which is crucial for our surface and lead inspections.
Marking Permanency
By using industry-proven methods for detecting anomalies of the surface integrity, our inspectors perform a basic scrape test to start, and then swab with mineral spirits, alcohol, or acetone. These basic detection methods check part markings, blacktopping, and mold cavities. Our advanced surface integrity screening is under the below section titled “Heated Solvents.”
X-Ray Signature Analysis
Our Creative Electron TruView 180 X-Ray machine allows us to see the internal structure of components. This precision equipment has the ability to do a 100% inspection for components on reels and also uses facial recognition software to compare the internal structure, die frame, die size, and location of wire bonds to a golden/known-quality sample.
Decapsulation/Delidding
Our Nisene JetEtch chemical decapsulation machine removes the encapsulation from ceramic and plastic chips to expose the internal die wafer and wafer bonds, ensuring it’s marked with the original component manufacturer logo and part series.
Low Power Electrical
Our electrical analysis capabilities revolve around low power electrical confirmations. We have the ability to conduct this electronic component testing on capacitors, resistors, inductors, transistors, relays, crystals, diodes, chokes, thyristors, batteries, fuses, op amps, and switches.
BGA & QFN Analysis
To look for common defects like voiding, shorts, and cracks, we use ball grid array (BGA) and quad flat pack no-lead (QFN) X-ray analysis. These analyses are very valuable for our customers using older technology parts, which may have been stored for longer periods of time.
Heated Solvents Analysis
Using a mixture of chemicals heated to extreme levels, our aggressive heated solvent test is used to identify remarking that did not dissolve with acetone during marking permanency electronic component testing. This ensures a component’s surface integrity has not been tampered with in any way, confirming no blacktopping or remarking has occurred.
Solderability Screening
To confirm lead integrity of older components, we use our X-Tronic soldering station or temperature-regulated soldering pot. Each test the solderability of components by applying leaded or lead-free solder to make sure IPC wetting solderability standards for leaded and RoHS components is achieved.
XRF Analysis
Using our high-precision S1 Titan XRF Analyzer, we evaluate the elemental breakdown of lead materials and determine if they are authentic and if there are any hazardous [RoHS] substances present.
Automated Reel to Reel
Our Creative Electronic Hawk 2 X-Ray machine uses facial recognition software—the same type employed by Homeland Security—to perform a 100% visual inspection for parts on reels. It also analyzes the top surface of components to a golden/known-quality sample for comparison purposes.
Curve Trace Analysis
We employ an ABI Sentry V/I Signature Curve trace to find electronically-damaged pins or detect ESD damage on components. This technique also has the ability to identify missing or incorrect dies and a lack of wire bonds or inaccurate pinouts, providing a simple pass/fail result.
Moisture Baking
MSL-rated components are required to be pre-baked before assembly, so we ensure any that are not factory sealed or may have been opened are properly baked in our Yamato DKN-812 oven to remove any moisture. Next, they’re dry-packed and shipped to you, free of charge.
Programming
Using our Xeltek SuperPro Programmer, we can program components, remove programs, or check to see if programs have been added previously.
3D Imaging
Our Keyence VHX2000 also has 3D imaging and measurement capabilities which can be used to inspect component assembly fast and accurately. Typical measurements include component dimensions, orientation, material thickness, and surface properties such as roughness and flatness. This information is then compared with known data to identify possible deviations.
All Parts Visually Inspected
We conduct a 72-point visual confirmation on every order, ensuring no detail is overlooked.
Convenient Customer Portal
Our customers are able to log in to a personal portal to view data on all electronic component tests along with photos, order tracking details, and more.
Reliable Results
All test results are backed by detailed inspection or lab reports and high-resolution images, providing you with clear insights into the quality and reliability of your components.