Electronic Component Testing & Inspection Lab

With a magnification ability of 20-1000x and fully-motorized stage, the Keyence VHX2000 provides us with extremely high-resolution imagery and depth-of-field photography, which is crucial for our surface and lead inspections.

By using industry-proven methods for detecting anomalies of the surface integrity, our inspectors perform a basic scrape test to start, and then swab with mineral spirits, alcohol, or acetone. These basic detection methods check part markings, blacktopping, and mold cavities. Our advanced surface integrity screening is under the below section titled “Heated Solvents.”

Our Creative Electron TruView 180 X-Ray machine allows us to see the internal structure of components. This precision equipment has the ability to do a 100% inspection for components on reels and also uses facial recognition software to compare the internal structure, die frame, die size, and location of wire bonds to a golden/known-quality sample.

Our Nisene JetEtch chemical decapsulation machine removes the encapsulation from ceramic and plastic chips to expose the internal die wafer and wafer bonds, ensuring it’s marked with the original component manufacturer logo and part series.

Our electrical analysis capabilities revolve around low power electrical confirmations. We have the ability to conduct this electronic component testing on capacitors, resistors, inductors, transistors, relays, crystals, diodes, chokes, thyristors, batteries, fuses, op amps, and switches.

To look for common defects like voiding, shorts, and cracks, we use ball grid array (BGA) and quad flat pack no-lead (QFN) X-ray analysis. These analyses are very valuable for our customers using older technology parts, which may have been stored for longer periods of time.

Using a mixture of chemicals heated to extreme levels, our aggressive heated solvent test is used to identify remarking that did not dissolve with acetone during marking permanency electronic component testing. This ensures a component’s surface integrity has not been tampered with in any way, confirming no blacktopping or remarking has occurred.

To confirm lead integrity of older components, we use our X-Tronic soldering station or temperature-regulated soldering pot. Each test the solderability of components by applying leaded or lead-free solder to make sure IPC wetting solderability standards for leaded and RoHS components is achieved.

Using our high-precision S1 Titan XRF Analyzer, we evaluate the elemental breakdown of lead materials and determine if they are authentic and if there are any hazardous [RoHS] substances present.

Our Creative Electronic Hawk 2 X-Ray machine uses facial recognition software—the same type employed by Homeland Security—to perform a 100% visual inspection for parts on reels. It also analyzes the top surface of components to a golden/known-quality sample for comparison purposes.

We employ an ABI Sentry V/I Signature Curve trace to find electronically-damaged pins or detect ESD damage on components. This technique also has the ability to identify missing or incorrect dies and a lack of wire bonds or inaccurate pinouts, providing a simple pass/fail result.

MSL-rated components are required to be pre-baked before assembly, so we ensure any that are not factory sealed or may have been opened are properly baked in our Yamato DKN-812 oven to remove any moisture. Next, they’re dry-packed and shipped to you, free of charge.

Using our Xeltek SuperPro Programmer, we can program components, remove programs, or check to see if programs have been added previously.

Our Keyence VHX2000 also has 3D imaging and measurement capabilities which can be used to inspect component assembly fast and accurately. Typical measurements include component dimensions, orientation, material thickness, and surface properties such as roughness and flatness. This information is then compared with known data to identify possible deviations.