ZF and Cree partners up to advance the electric drive:
(Source) ZF and Cree have partnered up to advance electric automotive technologies. Though the two companies already have an existing cooperation, their goal with this new project is to create efficient electric drivelines that are industry-leading. ZF expects to have silicon carbide electric drivelines on the market by 2022. “Partnering with a tier-one leading global automotive supplier like ZF for the use of silicon carbide-based power inverters in next generation electric vehicles is indicative of the integral role silicon carbide plays in extending the capabilities of EVs everywhere,” said Cree’s CEO, Gregg Lowe, about the partnership. The Head of ZF’s E-Mobility Division, Jörg Grotendorst, also commented on the partnership, saying “We’re delighted that we're building on our cooperation with Cree using their Wolfspeed silicon carbide technology and are absolutely convinced that combining our strengths will further improve efficiency and competitive edge for our components and systems.”
Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter:
(Source) According to SEMI Silicon Manufacturers Group (SMG), worldwide silicon wafer area shipments are down once again. Down almost 2% from Q2 and 9.9% less than this time last year, the total of square inches shipped in Q3 was 2,932. The Chairman of SEMI SMG, Neil Weaver, commented on the decline, saying, “Global silicon wafer shipments continue to ship at lower volumes relative to last year’s record levels.” Weaver places blame for this on the current political and economic climates, saying, “Ongoing geopolitical tensions and the overall economic slowdown have negatively impacted silicon demand for the year.”
Intel apologizes for CPU shortages:
(Source) Intel’s inability to produce enough 14nm CPUs to suffice their customers has been a rising problem since last September. Last week in a formal letter, Intel publicly apologized for their ongoing CPU shortage. Intel’s Executive VP and General Manager of Sales, MIchelle Johnston Holthaus, starts the letter by acknowledging the affect the shortage has had on those in need of their processors saying, “I’d like to acknowledge and sincerely apologize for the impact recent PC CPU shipment delays are having on your business and to thank you for your continued partnership.” Holthaus admits that Intel does not currently have a solution in place but that they “...will continue working tirelessly to provide you with Intel products to support your innovation and growth.”
US electronics imports from China down 12% Q1-Q3:
(Source) As reported this month, total US electronics imports dropped 6% within the first three quarters of this year. Though China still accounted for 54% of all US electronic imports, that figure is down 12% from last year. The decrease in tech imports is in direct correlation with the recent tariff wars. While China and Mexico have been negatively affected by the disputes, Vietnam and Taiwan are reaping the benefits. Imports from Vietnam is up 59% and 64% from Taiwan. Despite the shifts in electronic import sourcing, US electronics manufacturing has not grown significantly.
Yageo to Acquire KEMET for US $27.20 Per Share in Cash:
(Source) KEMET put out an official news release earlier this month stating they have been acquired by Yageo, a leading global electronic component company. As per the terms of agreement, Yageo will acquired all of KEMET’s outstanding shares of common stock at $27.20 USD. The transaction will be done cash, valuing at $1.8B USD. That valuation also accounts for the assumption of net debt. The Chairman and CEO of Yageo, Pierre Chen said about the acquisition, “KEMET has remarkable technology innovation capabilities and a proven track record of integrating cross-border acquisitions. We have been following their success with great admiration and look forward to creating a new legacy for the combined company.” The CEO of KEMET, William Lowe Jr., also commented on the acquisition saying, “We are pleased to reach this agreement with Yageo, which will deliver the certainty of immediate cash to our shareholders at a premium… I am confident that the combination of these two companies will provide customers with an enhanced experience and our employees with greater opportunities worldwide and we look forward to completing this transaction and ensuring a seamless transition.” This acquisition will allow Yageo to operate as a ‘one-stop-shop’ for electronic components and is projected to have a highly profitable outcome.
New Product Releases:
1. Murata- 600W eighth brick DC-DC converter:
Murata’s new power solution product series, the DRE-11.4/53-L48 eighth brick Intermediate Bus Converter (IBC), delivers 96% efficiency, which is the highest in the industry at this size and power output level. This series was created to address the growing power requirements needed by telecommunications and networking infrastructures and its ideal applications are those that require a highly efficient, 600W intermediate bus converter that can support a Vin range of 36-60Vdc.
2. TDK- World's first multilayer
band-pass filter:
TDK has expanded their line of high frequency, multilayer products with its new multilayer band-pass filter for the 28 GHz band in 5G mobile communication networks. The new component is able to suppress frequency fluctuations in millimeter wave bands. Its main applications would be for RF transceiver circuits in 5G base stations and other mobile communication equipment. Its main benefits include:
- High attenuation, low insertion loss and low group delay (for the 28 GHz band)
- Compact dimensions (2.5 x 2.0 x 0.9 mm)
3. Xilinx-World's Highest Performance Devices for Advanced ADAS and AD Applications:
Xilinx added two new devices to its automotive-qualified 16 nm family this month, the Xilinx® Automotive (XA) Zynq® UltraScale+™ MPSoC 7EV and 11EG. New product features include, but are not limited to:
- Capacity to be highly programmed
- Compute acceleration for L2+ to L4 advanced driver-assistance systems (ADAS) & autonomous driving (AD)
- High-speed data aggregation, pre-processing, and distribution (DAPD)
With this family expansion, Xilinx now offers the “world’s highest level of silicon integration that meets the safety, quality and reliability requirements for automotive.”
Stay on top of the latest developments in the industry by subscribing to the Sensible Micro blog today.
